AMAOE Stencil AU2
Availability: In Stock
₹160
AMAOE Stencil AU2 Specifications
Product Overview
- Model: AMAOE AU2
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil AU2 is a professional-grade reballing tool designed for precise rework of BGA (Ball Grid Array) chips commonly found in smartphones, tablets, and other compact electronics. This stencil ensures accurate placement of solder balls, making it essential for efficient repair and reballing tasks.
- Material: High-quality stainless steel for heat and corrosion resistance
- Thickness: 0.12MM, providing precision in reballing depth and solder ball placement
- Dimensions: Compact and easy to use, designed for small electronics like smartphones and tablets
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering and reballing processes
- Compatibility: Supports various BGA chips used in mobile devices, ensuring versatility in repair applications
Included Accessories
- Optional Support Frame: Some packages may come with a support base to assist with chip alignment and handling during reballing.
- User Manual: A guide to proper handling, cleaning, and using the stencil for optimal results.
Usage
- Ideal for: Professional mobile device repair technicians and electronics specialists who work with BGA reballing. The AMAOE AU2 stencil ensures precise and efficient chip reballing, making it essential for high-quality repairs.
- New
AMAOE Stencil U-SMG1
Availability: In Stock
₹160
AMAOE Stencil U-SMG1 Specifications
Product Overview
- Model: AMAOE U-SMG1
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-SMG1 is designed specifically for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil facilitates precise alignment and placement of solder balls on various chips, ensuring high-quality rework on smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability
- Thickness: 0.12MM, designed for precision in reballing and solder ball placement
- Dimensions: Compact size, suitable for use in tight spaces typically found in electronic devices
- Heat Resistance: Up to 500°C, allowing for high-temperature soldering applications
- Compatibility: Designed to accommodate various BGA chip sizes, enhancing its utility in electronic repairs
Included Accessories
- Support Frame (Optional): Some packages may include a support frame to assist with aligning the stencil accurately during use.
- Instruction Manual: Provides guidelines for proper usage, maintenance, and care of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-SMG1 stencil is essential for achieving accurate and reliable results in mobile device repairs and other electronic applications.
- New
AMAOE Stencil U-SMG2
Availability: In Stock
₹160
AMAOE Stencil U-SMG2 Specifications
Product Overview
- Model: AMAOE U-SMG2
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-SMG2 is engineered for precision in BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil aids in the accurate alignment and placement of solder balls on various chips, ensuring high-quality repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for enhanced durability and longevity
- Thickness: 0.12MM, providing precision in solder ball placement and depth
- Dimensions: Compact design for ease of use in tight electronic spaces
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering tasks
- Compatibility: Accommodates various BGA chip sizes, making it suitable for a diverse range of electronic repairs
Included Accessories
- Optional Support Frame: Some packages may include a support frame to facilitate accurate alignment during reballing.
- User Manual: Includes instructions for proper handling, care, and usage to ensure optimal results with the stencil.
Usage
- Ideal for: Professional electronics repair technicians specializing in BGA chip reballing. The AMAOE U-SMG2 stencil is crucial for achieving accurate and reliable solder ball placement, ensuring high-quality repairs in mobile device and electronic component servicing.
- New
AMAOE Stencil U-SMG3
Availability: In Stock
₹160
AMAOE Stencil U-SMG3 Specifications
Product Overview
- Model: AMAOE U-SMG3
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-SMG3 is specifically designed for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil allows for precise alignment and placement of solder balls on various chips, ensuring high-quality rework on smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for enhanced durability and heat resistance
- Thickness: 0.12MM, providing precision in solder ball placement and reballing processes
- Dimensions: Compact design for ease of handling and use in tight spaces typical of electronic devices
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering tasks
- Compatibility: Designed to accommodate various BGA chip sizes, enhancing its utility in electronics repair applications
Included Accessories
- Optional Support Frame: Some packages may include a support frame to assist with accurate alignment during reballing.
- Instruction Manual: Provides guidelines for proper handling, usage, and maintenance of the stencil for optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-SMG3 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-SMG5
Availability: In Stock
₹160
AMAOE Stencil U-SMG5 Specifications
Product Overview
- Model: AMAOE U-SMG5
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-SMG5 is designed specifically for BGA (Ball Grid Array) reballing applications. This stencil is a crucial tool for electronics repair professionals, enabling precise alignment and placement of solder balls on various chips, ensuring top-quality repairs on smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for enhanced durability and heat resistance
- Thickness: 0.12MM, providing precision in solder ball placement and reballing processes
- Dimensions: Compact and practical design for ease of handling in tight spaces typical of electronic devices
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering applications
- Compatibility: Designed to accommodate various BGA chip sizes, enhancing its utility for a wide array of electronic repairs
Included Accessories
- Optional Support Frame: Some packages may include a support frame to assist with accurate alignment during the reballing process.
- Instruction Manual: Includes guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-SMG5 stencil is essential for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and various electronic applications.
- New
AMAOE Stencil U-SMG4
Availability: In Stock
₹160
AMAOE Stencil U-SMG4 Specifications
Product Overview
- Model: AMAOE U-SMG4
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-SMG4 is meticulously engineered for BGA (Ball Grid Array) reballing applications. It serves as an essential tool for electronics repair professionals, allowing for precise alignment and placement of solder balls on various chips, ensuring high-quality repairs on smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for superior durability and thermal stability
- Thickness: 0.12MM, ensuring precision in solder ball placement and depth
- Dimensions: Compact design for convenient handling and use in tight electronic spaces
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering applications
- Compatibility: Accommodates various BGA chip sizes, ensuring usability across a range of electronic repair tasks
Included Accessories
- Optional Support Frame: Some packages may include a support frame to facilitate accurate alignment during reballing.
- User Manual: Comes with instructions for proper handling, care, and usage to ensure optimal performance with the stencil.
Usage
- Ideal for: Professional electronics repair technicians specializing in BGA chip reballing. The AMAOE U-SMG4 stencil is vital for achieving precise and reliable solder ball placement, guaranteeing high-quality repairs in mobile device servicing and other electronics applications.
- New
AMAOE Stencil U-MTK1
Availability: In Stock
₹160
AMAOE Stencil U-MTK1 Specifications
Product Overview
- Model: AMAOE U-MTK1
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-MTK1 is specifically designed for BGA (Ball Grid Array) reballing tasks, making it an essential tool for electronics repair professionals. This stencil ensures precise alignment and accurate placement of solder balls on various chips, guaranteeing high-quality repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for superior durability and thermal stability
- Thickness: 0.15MM, ensuring precision in solder ball placement and reballing processes
- Dimensions: Compact design facilitates easy handling and use in confined electronic spaces
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering applications
- Compatibility: Accommodates various BGA chip sizes, ensuring usability across a range of electronic repair tasks
Included Accessories
- Optional Alignment Frame: Some packages may come with a support frame to assist in achieving accurate alignment during reballing.
- User Manual: Includes instructions for proper handling, care, and usage to ensure optimal performance with the stencil.
Usage
- Ideal for: Professional electronics repair technicians specializing in BGA chip reballing. The AMAOE U-MTK1 stencil is vital for achieving precise and reliable solder ball placement, guaranteeing high-quality repairs in mobile device servicing and other electronics applications.
- New
AMAOE Stencil U-MTK2
Availability: In Stock
₹160
AMAOE Stencil U-MTK2 Specifications
Product Overview
- Model: AMAOE U-MTK2
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-MTK2 is designed for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil ensures accurate alignment and placement of solder balls on various chips, providing reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for improved durability and thermal stability
- Thickness: 0.15MM, allowing for precision in solder ball placement and reballing processes
- Dimensions: Compact design enables easy handling and use in tight electronic spaces
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering applications
- Compatibility: Designed to work with various BGA chip sizes, enhancing usability across a range of electronic repairs
Included Accessories
- Optional Support Frame: Some packages may include a support frame to assist with accurate alignment during the reballing process.
- Instruction Manual: Provides guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-MTK2 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-MTK3
Availability: In Stock
₹160
AMAOE Stencil U-MTK3 Specifications
Product Overview
- Model: AMAOE U-MTK3
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-MTK3 is expertly designed for BGA (Ball Grid Array) reballing tasks, making it an indispensable tool for electronics repair professionals. This stencil ensures accurate alignment and precise placement of solder balls on various chips, facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for increased durability and thermal stability.
- Thickness: 0.15MM, ensuring precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for easy handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering tasks.
- Compatibility: Suitable for various BGA chip sizes, enhancing usability across diverse electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist in achieving accurate alignment during the reballing process.
- User Manual: Provides guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-MTK3 stencil is essential for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-MTK4
Availability: In Stock
₹160
AMAOE Stencil U-MTK4 Specifications
Product Overview
- Model: AMAOE U-MTK4
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-MTK4 is engineered for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil ensures precise alignment and accurate placement of solder balls on various chips, enabling reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for enhanced durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for easy handling and usability in tight electronic spaces.
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Compatible with a wide range of BGA chip sizes, enhancing usability across various electronic repair tasks.
Included Accessories
- Optional Alignment Frame: Some packages may come with a support frame to assist with accurate alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals focusing on BGA chip reballing. The AMAOE U-MTK4 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-MTK5
Availability: In Stock
₹160
AMAOE Stencil U-MTK5 Specifications
Product Overview
- Model: AMAOE U-MTK5
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-MTK5 is meticulously designed for BGA (Ball Grid Array) reballing applications, making it an indispensable tool for electronics repair professionals. This stencil guarantees accurate alignment and precise placement of solder balls on various chips, ensuring reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for increased durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for easy handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering tasks.
- Compatibility: Suitable for various BGA chip sizes, enhancing usability across diverse electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist in achieving accurate alignment during the reballing process.
- User Manual: Provides guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-MTK5 stencil is essential for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-MTK6
Availability: In Stock
₹160
AMAOE Stencil U-MTK6 Specifications
Product Overview
- Model: AMAOE U-MTK6
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-MTK6 is expertly crafted for BGA (Ball Grid Array) reballing applications, serving as an essential tool for electronics repair technicians. This stencil ensures precise alignment and accurate placement of solder balls on various chips, enabling reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for improved durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for easy handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, ideal for various high-temperature soldering tasks.
- Compatibility: Compatible with an extensive range of BGA chip sizes, enhancing usability across multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals focusing on BGA chip reballing. The AMAOE U-MTK6 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-MTK7
Availability: In Stock
₹160
AMAOE Stencil U-MTK7 Specifications
Product Overview
- Model: AMAOE U-MTK7
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-MTK7 is engineered for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair specialists. This stencil ensures accurate alignment and precise placement of solder balls on various chips, facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for increased durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for easy handling and use in tight electronic spaces.
- Heat Resistance: Up to 500°C, ideal for various high-temperature soldering tasks.
- Compatibility: Suitable for a broad range of BGA chip sizes, enhancing usability across diverse electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with achieving accurate alignment during the reballing process.
- User Manual: Provides guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-MTK7 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD1
Availability: In Stock
₹160
AMAOE Stencil U-QSD1 Specifications
Product Overview
- Model: AMAOE U-QSD1
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD1 is specifically designed for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil ensures precise alignment and accurate placement of solder balls on various chips, enabling reliable repairs for smartphones, tablets, and other electronic devices.
- Material: Premium stainless steel for enhanced durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for easy handling and use in tight electronic spaces.
- Heat Resistance: Up to 500°C, ideal for various high-temperature soldering tasks.
- Compatibility: Suitable for a diverse range of BGA chip sizes, enhancing usability across multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD1 stencil is essential for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD2
Availability: In Stock
₹160
AMAOE Stencil U-QSD2 Specifications
Product Overview
- Model: AMAOE U-QSD2
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD2 is specifically designed for BGA (Ball Grid Array) reballing applications. It is an essential tool for electronics repair professionals, ensuring precise alignment and accurate placement of solder balls on various chips, which facilitates reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, ideal for various high-temperature soldering tasks.
- Compatibility: Suitable for a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD2 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD5
Availability: In Stock
₹160
AMAOE Stencil U-QSD5 Specifications
Product Overview
- Model: AMAOE U-QSD5
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD5 is expertly designed for BGA (Ball Grid Array) reballing applications. This stencil is an essential tool for electronics repair professionals, ensuring precise alignment and accurate placement of solder balls on various chips, facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact and lightweight design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, ideal for various high-temperature soldering tasks.
- Compatibility: Suitable for diverse BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Offers essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD5 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
Mobile Essentials: Smartphones & Accessories for Seamless Connectivity
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