AMAOE Stencil SAM17
Availability: In Stock
₹160
AMAOE Stencil SAM17 Specifications
Product Overview:
- Model: AMAOE Stencil SAM17
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in Samsung devices.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel that is resistant to corrosion and thermal damage, ensuring durability for extended use.
- Thickness: 0.15 mm, offering a balanced rigidity and flexibility suitable for multiple reballing cycles.
- Dimensions: Compact design compatible with standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliability during use.
- Target Devices: Optimized for various Samsung processors and BGA chips found in Samsung smartphones and tablets, ensuring precise fitting for effective repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in Samsung device repairs.
- Applications: Best suited for reballing Samsung processors and other critical BGA components, ensuring high-quality and accurate repairs for Samsung smartphones and tablets.
The AMAOE Stencil SAM17 is engineered to provide technicians with a reliable and efficient tool for BGA reballing, specifically tailored to meet the requirements of Samsung device repairs.
- New
AMAOE Stencil 1+10PRO
Availability: In Stock
₹160
AMAOE Stencil 1+10PRO Specifications
Product Overview:
- Model: AMAOE Stencil 1+10PRO
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing BGA chips across a variety of electronic devices, catering to both professional and advanced repair technicians.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, which is resistant to corrosion and thermal damage for long-lasting performance.
- Thickness: 0.15 mm, providing an optimal combination of rigidity and flexibility for multiple reballing cycles.
- Dimensions: Compact design to fit standard reballing equipment, enhancing usability in various repair scenarios.
Performance Characteristics:
- Heat Resistance: Engineered to withstand the high temperatures associated with soldering without warping or degrading, ensuring reliable performance during the reballing process.
- Compatibility: Suitable for a wide range of BGA components, making it an excellent choice for technicians who work with multiple brands and models.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians and electronic repair shops that require versatility in their repair tools.
- Applications: Well-suited for reballing processors and critical BGA components across various electronic devices, ensuring high-quality and accurate repairs.
The AMAOE Stencil 1+10PRO is designed to provide repair technicians with a reliable and efficient tool for BGA reballing, adaptable to a range of electronic device repairs.
- New
AMAOE Stencil Universal
Availability: In Stock
₹160
AMAOE Stencil Universal Specifications
Product Overview:
- Model: AMAOE Stencil Universal
- Type: High-Precision BGA Reballing Stencil
- Application: Versatile stencil designed for reballing BGA chips across various devices, not limited to specific manufacturers.
- Weight: Approximately 0.5 kg (verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, offering resistance to corrosion and thermal damage for long-lasting performance.
- Thickness: 0.15 mm, providing an optimal balance of rigidity and flexibility for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability in repair processes.
Performance Characteristics:
- Heat Resistance: Designed to withstand high temperatures encountered during soldering without warping or degrading, ensuring consistent reliability.
- Compatibility: Suitable for a wide range of BGA components, making it an excellent choice for technicians who work on various devices, including smartphones, tablets, and laptops.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A comprehensive guide is provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians and shops that handle diverse electronic repairs.
- Applications: Well-suited for reballing various processors and critical BGA components across different brands, ensuring high-quality and accurate repairs.
The AMAOE Stencil Universal is designed to meet the needs of repair technicians who require a flexible and efficient tool for BGA reballing across various devices.
- New
AMAOE Stencil WSR1
Availability: In Stock
₹160
AMAOE Stencil WSR1 Specifications
Product Overview:
- Model: AMAOE Stencil WSR1
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing BGA chips used in various electronic devices, providing versatility for different brands and models.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel that is resistant to corrosion and thermal damage, ensuring durability for long-term use.
- Thickness: 0.15 mm, providing a balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design to fit standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures associated with soldering without warping or degrading, ensuring reliability during use.
- Compatibility: Suitable for a wide range of BGA components, making it an excellent choice for technicians working on various electronic devices, including smartphones, tablets, and computers.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians and electronic repair shops that handle a diverse range of devices.
- Applications: Best suited for reballing processors and critical BGA components across various brands, ensuring high-quality and accurate repairs.
The AMAOE Stencil WSR1 is designed to offer technicians a reliable and versatile tool for BGA reballing, capable of accommodating various electronic device repairs.
- New
AMAOE Stencil 1+9PRO
Availability: In Stock
₹160
AMAOE Stencil 1+9PRO Specifications
Product Overview:
- Model: AMAOE Stencil 1+9PRO
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing BGA chips used in a wide range of electronic devices, catering to both professional and advanced repair technicians.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, resistant to corrosion and thermal damage, ensuring durability for extended use.
- Thickness: 0.15 mm, providing a balance between rigidity and flexibility suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures associated with soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Suitable for a variety of BGA components, making it an excellent choice for technicians who work across multiple brands and models.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A comprehensive guide is provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians and electronic repair shops requiring versatile tools for various repairs.
- Applications: Best suited for reballing processors and critical BGA components across different electronic devices, ensuring high-quality and accurate repairs.
The AMAOE Stencil 1+9PRO is designed to provide technicians with a reliable and efficient tool for BGA reballing, suitable for a wide range of electronic device repairs.
- New
AMAOE Stencil IPH12-A14
Availability: In Stock
₹160
AMAOE Stencil IPH12-A14 Specifications
Product Overview:
- Model: AMAOE Stencil IPH12-A14
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 12 series.
- Weight: Approximately 0.5 kg (verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, offering excellent resistance to corrosion and thermal damage for long-lasting durability.
- Thickness: 0.15 mm, providing a suitable balance of rigidity and flexibility, ideal for multiple reballing cycles.
- Dimensions: Compact design compatible with standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during the soldering process without warping or degrading, ensuring reliable performance.
- Compatibility: Tailored for various BGA components used in iPhone models, making it an excellent choice for technicians focusing on Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in Apple device repairs, particularly those working on iPhone 12 series models.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH12-A14 is specifically designed to provide technicians with a reliable tool for BGA reballing, tailored for the iPhone 12 series.
- New
AMAOE Stencil IPH13-A15
Availability: In Stock
₹160
AMAOE Stencil IPH13-A15 Specifications
Product Overview:
- Model: AMAOE Stencil IPH13-A15
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 13 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage for enhanced durability.
- Thickness: 0.15 mm, striking a balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design compatible with standard reballing equipment, enhancing usability in various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures associated with soldering without warping or degrading, ensuring reliable performance during reballing.
- Compatibility: Optimized for various BGA components used in iPhone models, making it an excellent choice for technicians specializing in Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A comprehensive guide is provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focused on repairs for the iPhone 13 series and other Apple devices.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH13-A15 is specifically designed to provide technicians with a reliable and efficient tool for BGA reballing tailored to the iPhone 13 series.
- New
AMAOE Stencil IPH14-A16
Availability: In Stock
₹160
AMAOE Stencil IPH14-A16 Specifications
Product Overview:
- Model: AMAOE Stencil IPH14-A16
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 14 series.
- Weight: Approximately 0.5 kg (verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage for long-lasting durability.
- Thickness: 0.15 mm, which offers a balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design that fits standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during the soldering process without warping or degrading, ensuring reliable performance throughout reballing.
- Compatibility: Tailored for various BGA components used in iPhone models, making it an excellent choice for technicians focused on Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in Apple device repairs, particularly those working on iPhone 14 series models.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH14-A16 is specifically designed to provide technicians with a reliable tool for BGA reballing tailored for the iPhone 14 series.
- New
AMAOE Stencil IPH15-A17
Availability: In Stock
₹160
AMAOE Stencil IPH15-A17 Specifications
Product Overview:
- Model: AMAOE Stencil IPH15-A17
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 15 series.
- Weight: Approximately 0.5 kg (verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, which offers excellent resistance to corrosion and thermal damage, ensuring durability for extended use.
- Thickness: 0.15 mm, providing a good balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design that fits standard reballing equipment, enhancing usability during various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures associated with soldering without warping or degrading, ensuring reliable performance during reballing.
- Compatibility: Optimized for various BGA components used in iPhone models, making it an excellent choice for technicians specializing in Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A comprehensive guide is provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focused on repairs for the iPhone 15 series and other Apple devices.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH15-A17 is specifically designed to provide technicians with a reliable and efficient tool for BGA reballing tailored to the iPhone 15 series.
- New
AMAOE Stencil IPH6-A9
Availability: In Stock
₹160
AMAOE Stencil IPH6-A9 Specifications
Product Overview:
- Model: AMAOE Stencil IPH6-A9
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 6 to iPhone 9 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, offering excellent resistance to corrosion and thermal damage, ensuring durability and longevity.
- Thickness: 0.15 mm, providing a balanced combination of rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design that fits standard reballing equipment, enhancing usability in various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring consistent performance throughout the reballing process.
- Compatibility: Optimized for various BGA components used in iPhone models, making it an ideal choice for technicians specializing in Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on repairs for iPhone models ranging from iPhone 6 to iPhone 9.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH6-A9 is specifically designed to provide technicians with a reliable tool for BGA reballing tailored for the iPhone 6 to 9 series.
- New
AMAOE Stencil IPH6-A8
Availability: In Stock
₹160
AMAOE Stencil IPH6-A8 Specifications
Product Overview:
- Model: AMAOE Stencil IPH6-A8
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 6 to iPhone 8 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, which provides excellent resistance to corrosion and thermal damage, ensuring long-lasting durability.
- Thickness: 0.15 mm, striking a balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design compatible with standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures associated with soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Tailored for various BGA components used in iPhone models, making it an excellent choice for technicians specializing in Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on repairs for iPhone models ranging from iPhone 6 to iPhone 8.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH6-A8 is specifically designed to provide technicians with a reliable tool for BGA reballing tailored for the iPhone 6 to 8 series.
- New
AMAOE Stencil IPH6-A10
Availability: In Stock
₹160
AMAOE Stencil IPH6-A10 Specifications
Product Overview:
- Model: AMAOE Stencil IPH6-A10
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 6 to iPhone 10 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage, ensuring durability for extended use.
- Thickness: 0.15 mm, offering a good balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design that fits standard reballing equipment, enhancing usability during various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures associated with soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for various BGA components used in iPhone models, making it an excellent choice for technicians specializing in Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A comprehensive guide is provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on repairs for iPhone models ranging from iPhone 6 to iPhone 10.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH6-A10 is specifically designed to provide technicians with a reliable tool for BGA reballing tailored for the iPhone 6 to 10 series.
- New
AMAOE Stencil DM-13/13Mini
Availability: In Stock
₹160
AMAOE Stencil DM-13/13Mini Specifications
Product Overview:
- Model: AMAOE Stencil DM-13/13Mini
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in a variety of electronic devices, particularly suited for the DM-13 series and its mini variant.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, offering excellent resistance to corrosion and thermal damage, ensuring durability for extended use.
- Thickness: 0.15 mm, providing an ideal balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for a range of BGA components used in electronic devices, making it an excellent choice for technicians specializing in electronic device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide is provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on reballing BGA components in various electronic devices.
- Applications: Best suited for reballing processors and critical BGA components, ensuring high-quality and accurate repairs across a range of electronic devices.
The AMAOE Stencil DM-13/13Mini is specifically designed to provide technicians with a reliable tool for BGA reballing in various electronic applications.
- New
AMAOE Stencil IPH6-A11
Availability: In Stock
₹160
AMAOE Stencil IPH6-A11 Specifications
Product Overview:
- Model: AMAOE Stencil IPH6-A11
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 6 to iPhone 11 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, which offers excellent resistance to corrosion and thermal damage, ensuring durability for extended use.
- Thickness: 0.15 mm, providing a balanced combination of rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design that fits standard reballing equipment, enhancing usability during various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for various BGA components used in iPhone models, making it an excellent choice for technicians specializing in Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on repairs for iPhone models ranging from iPhone 6 to iPhone 11.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH6-A11 is specifically designed to provide technicians with a reliable tool for BGA reballing tailored for the iPhone 6 to 11 series.
- New
AMAOE Stencil DM-11/11P/11PM
Availability: In Stock
₹160
AMAOE Stencil DM-11/11P/11PM Specifications
Product Overview:
- Model: AMAOE Stencil DM-11/11P/11PM
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing BGA chips used in various electronic devices, with a focus on those compatible with the DM-11 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage, ensuring long-lasting durability.
- Thickness: 0.15 mm, offering a balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability in various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for a range of BGA components used in electronics, making it an excellent choice for technicians specializing in electronic device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on reballing BGA components in various electronic devices.
- Applications: Best suited for reballing processors and critical BGA components, ensuring high-quality and accurate repairs across a range of electronic devices.
The AMAOE Stencil DM-11/11P/11PM is specifically designed to provide technicians with a reliable tool for BGA reballing across various electronic applications.
- New
AMAOE Stencil DM-12/12P/12PM
Availability: In Stock
₹160
AMAOE Stencil DM-12/12P/12PM Specifications
Product Overview:
- Model: AMAOE Stencil DM-12/12P/12PM
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing BGA chips used in various electronic devices, specifically tailored for the DM-12 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage, ensuring durability and long-lasting use.
- Thickness: 0.15 mm, striking a balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design intended to fit standard reballing equipment, enhancing usability in various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for a range of BGA components used in electronic devices, making it an excellent choice for technicians specializing in electronic device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide is provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on reballing BGA components in various electronic devices.
- Applications: Best suited for reballing processors and critical BGA components, ensuring high-quality and accurate repairs across a range of electronic devices.
The AMAOE Stencil DM-12/12P/12PM is specifically designed to provide technicians with a reliable tool for BGA reballing across various electronic applications.
- New
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