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    AMAOE Stencil SAMSUNG E883SP AMAOE Stencil SAMSUNG E883SP
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    AMAOE Stencil SAMSUNG E883SP
    Availability: In Stock
    ₹161

    AMAOE Stencil Samsung E8835SP Specifications

    Product Overview:

    • Model: AMAOE Stencil E8835SP
    • Type: High-Precision BGA Reballing Stencil
    • Application: Specifically designed for reballing BGA chips used in various Samsung devices, particularly for the E8835SP model.

    Key Features:

    • Premium Stainless Steel Construction: Crafted from high-quality stainless steel, ensuring durability and resistance to corrosion and thermal damage.
    • Laser-Cut Precision: Features laser-cut openings for accurate alignment, which ensures consistent and precise solder ball placement during the reballing process.
    • Standard Thickness: Designed with a thickness of 0.15MM, striking a balance between flexibility and robustness for optimal solder ball application.
    • High Heat Resistance: Engineered to withstand the elevated temperatures associated with the reballing process, ensuring reliability and longevity.
    • Compatibility: Tailored for Samsung E8835SP BGA components, making it an excellent choice for technicians focusing on repairs for Samsung devices.

    Specifications:

    • Material: Premium-grade stainless steel that is resistant to corrosion and thermal damage for extended usage.
    • Thickness: 0.15MM, which provides a good balance between rigidity and flexibility, suitable for multiple reballing cycles.
    • Dimensions: Compact design to fit standard reballing equipment, enhancing usability in repair processes.
    • Heat Resistance: Capable of withstanding elevated temperatures encountered during soldering without warping or degrading.
    • Target Devices: Optimized for Samsung E8835SP processors and various BGA chips, ensuring precise fitting for effective repairs.

    Included Components:

    • Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
    • User Manual: A detailed guide is provided to assist technicians in effectively utilizing the stencil for BGA reballing.

    Usage:

    • Target Audience: Ideal for professional repair technicians specializing in Samsung device repairs.
    • Applications: Best suited for reballing Samsung processors and other critical BGA components, ensuring high-quality and accurate repairs for Samsung smartphones and tablets.

    The AMAOE Stencil E8835SP is designed to provide technicians with the tools needed for efficient and effective reballing of BGA chips, particularly in Samsung devices.

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